MICROELECTRONIC CIRCUITRY IN MICRO-MODULES

Abstract

The microminiaturization of a Signal Corps air encoder subassembly is described. The subassembly is a shift register consisting of 28 flip-flops, 1 gate, and 3 driver circuits. These circuits are to be vacuum deposited on .310 inch square glass substrates and then stacked into micro-modules .625 inches in height. The techniques involved in monitoring the vacuum deposition of all films are discussed. Also discussed is a multiprobe jig which makes contact to 22 terminals of a deposited flip-flop and a mask changer which allows the changing of 4 masks without breading vacuum. Maximum accumulated mask registration tolerance is +/- .003 inches.

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Document Details

Document Type
Technical Report
Publication Date
Nov 30, 1961
Accession Number
AD0273728

Entities

People

  • Hannsjörg A. Weber
  • L. Gille
  • S. Weld

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Electronic Circuits
  • Electronic Components
  • Electronics
  • Electronics Laboratories
  • Engineering
  • Fabrication
  • Films
  • Guidance
  • Inertial Navigation
  • Materials
  • New Jersey
  • Photographic Equipment
  • Semiconductors
  • Shift Registers
  • Test Sets
  • Thin Films

Fields of Study

  • Physics

Readers

  • Combustion and Flow Dynamics.
  • Integrated Circuit Design and Technology.
  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems