COMPATIBLE TECHNIQUES FOR INTEGRATED CIRCUITRY

Abstract

Most of the effort to date has been spent in developing process techniques which are necessary for integrated circuit fabrication. This effort has been both in morphological areas and thin films as applied to semiconducting substrate. Further efforts in perfecting our epitaxial techniques are reported. A program has been started to develop and fabricate typical circuits which are practical for a wide range of high and low frequency amplifier applications as well as logic circuits.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1962
Accession Number
AD0273829

Entities

Organizations

  • Motorola Mobility

Tags

DTIC Thesaurus Topics

  • Air Force
  • Aluminum Oxides
  • Capacitance
  • Chemistry
  • Control Systems
  • Failure Mode And Effect Analysis
  • Integrated Circuits
  • Materials
  • Materials Processing
  • Materials Science
  • Oxide Films
  • P-N Junctions
  • Resonant Circuits
  • Semiconductors
  • Silicon Dioxide
  • Thin Films
  • Tuned Circuits

Fields of Study

  • Physics

Readers

  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design