MICROMINIATURIZED PACKAGING OF 2N384 AND 2N697
Abstract
Efforts were made to mount existing germanium drift field and silicon mesa transistor junction structures in an existing welded hermetically sealed miniature pancake package by making necessary part modifications and developing required assembly procedures. Design changes were made in the drift field transistor junction - base tab assembly and in the transistor header. A welded connection between base tab and base header lead was required to meet objective shock test requirements. Samples meeting the objective specifications were evaluated and delivered. The silicon mesa transistor junction structure required no modification. A molybdenum pedestal was added to the header for this device and associated material, brazing, and plating problems were solved. Samples meeting the objective specification were evaluated and delivered. The final packaged devices demonstrated excellent hermetic sealing.
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1962
- Accession Number
- AD0273848
Entities
People
- C. Lawrenson
- I. Feinberg
- L. Epstein
Organizations
- Sylvania Electric Products