Materials and Structures Electroplating of Tungsten from Nonaqueous Lewis Acid Solutions

Abstract

An experimental investigation of the electroplating of tungsten from organic electrolytic solutions is described. The method depends on solution of a tungsten halide in a Lewis acid solvent which will leave the tungsten in the cationic state. Preliminary tests with tungsten hexachloride dissolved in a boron trifluoride ethereate did not yield a metallic tungsten plate.

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Document Details

Document Type
Technical Report
Publication Date
Feb 28, 1962
Accession Number
AD0273855

Entities

People

  • F.d. Hess
  • L. Schieler

Organizations

  • The Aerospace Corporation

Tags

Communities of Interest

  • Weapons Technologies

DTIC Thesaurus Topics

  • Acids
  • Air Force
  • Alkenes
  • Aqueous Solutions
  • Chemistry
  • Chlorides
  • Electroplating
  • Equations
  • Films
  • Halides
  • Lewis Acids
  • Materials
  • Mechanical Properties
  • Melting Point
  • Metals
  • Plating
  • Tungsten

Readers

  • Polymer Science and Technology
  • Surface Engineering/Surface Coating Technology.