PRODUCTION ENGINEERING MEASURE. DIFFUSED SEMICONDUCTOR DEVICES 7,12 PLUS 2N559 AND 2N1094
Abstract
Development and pilot production objectives for devices 7 and 12 were met. Mechanization of 4 device 12 operations was accomplished and the mechanized pilot production was accepted. Mechanization of devices - 2N559 and 2N1094 is presented in the following areas: cleaning header lead wire, piece part cleaning, piece part gold plating, platform lead welding, header assembling, header glassing, header lead trimming, strip perforating and welding, header continuous rack plating, can punching and coding, can getter assembling, slice scribing, wafer breaking, screening and loading, wafer bonding, wire bonding, final cleaning, closure welding, coating, card loading, testing and date stamping 2N559, testing and date stamping - 2N1094 and 2N1195, data handling, and card trimming and packaging.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 10, 1961
- Accession Number
- AD0273879
Entities
People
- M. N. Reppert