DEVELOPMENT OF HIGH-TEMPERATURE STRAIN-GAGE BONDING MATERIALS CURABLE AT LOW TEMPERATURES (PART IV)

Abstract

Compositions were prepared for strain gage bonding. A low-temperature formulation of tubular alumina in a potassium silicate sol with suspending agent will cure to a high degree below 200 F if presealed with silicone between air setting and heating, and is electrically serviceable to 800 F. A high-temperature composition, designated formulation B52, based on the monoaluminum dihydrogen phosphate-silica mixture, but with chromic anhydride and alumina hydrate additions, cures adequately at 400 F or below and is useful even above the limiting service temperature of present strain-gage alloys, ca. 1600 F. Both cement types display good resistance to thermal shock and repeated rapid cycling; they are adequately strong for normal strain transmission purposes. The low-temperature cement is mechanically the stronger at all temperatures. Differential thermal analyses verified curing temperatures and suggest the possibility of low-temperature vacuum curing of phosphoric acid compositions. (Author)

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1960
Accession Number
AD0276259

Entities

People

  • H.l. Rechter
  • S.w. Bradstreet

Tags

DTIC Thesaurus Topics

  • Differential Thermal Analysis
  • Gages
  • High Temperature
  • Low Temperature
  • Phosphoric Acids
  • Strain Gages
  • Thermal Analysis
  • Thermal Shock

Fields of Study

  • Materials science

Readers

  • Reinforced Composite Materials
  • Surface Engineering/Surface Coating Technology.
  • Thermal Physics or Thermal Science.