HEAT TRANSFER RATES AND INSULATED WALL TEMPERATURES FOR A TRANSPIRATION COOLED HEMISPHERE

Abstract

Existing solutions to he bou dary layer equations with helium injection and constant free stream pressure gradient are used to calculate the injection distribution on a hemisphere re uir d to maintain a constant wall temperature. The method used is an extension of the wedgematching technique. The fabrication and calibration of a wind tunnel model designed on this basis is described. The resulting distributions of wall temper ture, insulated wall temperature and Stanton number are presented, and the variation of thes quantities with injection rate, using air and helium as coolants. The design technique proved satisfactory. The insulated wall temperature near the ose, for helium injection, is nearly ten per cent higher than the tunnel stagnation temper ture. It is suggested that this may result from the thermal diffusion of the helium within the boundary layer. The Stanton numbers obtained with air and helium agree with theoretical predictions, and the corresponding heat fluxes demonstrate that mass transfer cooling on a blunt body is very effective. On the other hand, the anticipated superiority of helium over air does not occur, since the adverse effec of helium injection on the insulated wall temperature negates the corresponding reduction in heat transfer coefficient. (Author)

Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1960
Accession Number
AD0278447

Entities

People

  • Albert F. Jr. Gollnick

Organizations

  • Air Force Research Laboratory

Tags

DTIC Thesaurus Topics

  • Blunt Bodies
  • Bodies
  • Boundary Layer
  • Coefficients
  • Diffusion
  • Free Stream
  • Heat Flux
  • Heat Transfer
  • Heat Transfer Coefficients
  • Hemispheres
  • Layers
  • Mass Transfer
  • Pressure Gradients
  • Thermal Diffusion
  • Wind Tunnel Models
  • Wind Tunnels

Fields of Study

  • Physics

Readers

  • Combustion and Flow Dynamics.
  • Fluid Dynamics.
  • Snow Cover Descriptors for Reptiles and Their Illustrations.

Technology Areas

  • Microelectronics