MICROCIRCUITRY BY CHEMICAL DEPOSITION,

Abstract

Techniques for chemically depositing Ni alloy films on insulating substrates and for etching patterns in thin Cu conductors, were combined and modified to permit the fabrication of Ni alloy thin films in varied and controlled geometries. The resistivities of the films produced were varied from a few ohms per square to several thousand ohms per square, but, at present, tolerances on reproducibility limit the working range to a maximum of about 500 ohms per square. Resistive and conductive parts made of nickel alloy films of approximately 500 ohms per square have been employed in microcircuits in which the tolerances on resistance values are about + or - 30%. Although variations in films resistivity between batches sometimes exceeds these tolerances, the close agreement among films from the same batch and the ability to measure resistivities prior to committing films to circuit production allowed such circuits to be fabricated. Modifications of procedures to increase the reproducibility of resistance values are being investigated. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 22, 1962
Accession Number
AD0281843

Entities

People

  • Emma Lee Hebb

Organizations

  • Harry Diamond Laboratories

Tags

DTIC Thesaurus Topics

  • Agreements
  • Alloys
  • Circuits
  • Fabrication
  • Films
  • Geometry
  • Microcircuits
  • Nickel
  • Nickel Alloys
  • Production
  • Reproducibility
  • Resistance
  • Substrates
  • Thin Films

Fields of Study

  • Physics

Readers

  • Metallurgy
  • Nanofabrication and Microfabrication.
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene