MATERIALS AND STRUCTURES RESEARCH PROGRAM - ELECTROPLATING OF TUNGSTEN FROM NONAQUEOUS LEWIS ACID SOLUTIONS

Abstract

An exploratory study directed toward the electroplating of tungsten from organic solution is described. The possibility was investigated of introducing a third constituent into the plating bath to complex an anionic portion of the W salt, leaving the W in the cationic state for ready electrodeposition. Although a wide selection of coordinating compounds were tried, all results were negative. (Author)

Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1962
Accession Number
AD0283341

Entities

People

  • F.d. Hess
  • L. Schieler

Organizations

  • The Aerospace Corporation

Tags

DTIC Thesaurus Topics

  • Acids
  • Coatings
  • Deposition (Materials Processing)
  • Electrodeposition
  • Electrolytic Processes
  • Electroplating
  • Lewis Acids
  • Material Coating Processes
  • Materials
  • Materials Processing
  • Plating
  • Tungsten

Readers

  • Polymer Science and Technology
  • Surface Engineering/Surface Coating Technology.
  • Systems Analysis and Design