SILICON SEMICONDUCTOR NETWORKS MANUFACTURING METHODS
Abstract
Process technique studies were effectively concluded. Manufacturing equipment designs, andASSEMBLY TECHNIQUES FOR SEMICONDUCTOR NETWORKS ARE BEING IMPROVED. Pilot-line equipment has been constructed and is b ing evaluated and improved. Effort has been concentrated on developi g and refining processes for producing single-chip, planar, oxide-protecte devices with evaporated-lead interconnections. Emphasis remains strong on doing as much processing as possible on silicon in slice form. This philosophy has necessitated further refinements to ensure isolation of components. Oxide thickness determination, gold-diffu ion isolation, contacts, application of thin-film dielectrics, and efforts to perfect packaging materials and techniques are discussed. A molecular electronic computer incorporating 587 semiconductor networks has been delivered and demonstrated to the Air Force. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 01, 1962
- Accession Number
- AD0283979
Entities
People
- H.g . Cragon
- J.w. Lathrop
- W.c. Brower
Organizations
- Texas Instruments