THERMAL GRAIN STRUCTURAL ANALYSIS

Abstract

Methods for determining temperature distributions for cylindrical grains under various types of surface temperature variations were developed for the subsequent viscoelastic transient thermal stress analysis. These methods were verified by experiments performed on cylindrical grains with thermocouples cast in place. The viscoelastic thermal stress problem has been reduced for computer programming. Results of uniaxial thermal cycling experiments are presented. The effects of temperature on viscoelastic behavior have been determined experimentally and experimental results of failure tests on case-bonded grains are included.

Document Details

Document Type
Technical Report
Publication Date
Sep 14, 1962
Accession Number
AD0284206

Entities

People

  • A.l. Seward

Organizations

  • Lockheed Propulsion Company

Tags

DTIC Thesaurus Topics

  • Computer Programming
  • Computers
  • Physical Properties
  • Stress Analysis
  • Stresses
  • Structural Analysis
  • Surface Temperature
  • Thermal Stresses
  • Thermocouples

Readers

  • Mechanical Engineering/Mechanics of Materials.
  • Rocket Propulsion.
  • Thermal Physics or Thermal Science.