ULTRA HIGH TEMPERATURE DIELECTRIC EMBEDDING MATERIALS

Abstract

A glass was developed w ich has the same devitrification properties and better resistance to reduction than the comm rcially vailable type used previously. The optimum devitrification temperature of the glass was found to be between 550 C and 600 C. Fluidized bed operation was found to be most efficient u ing gl ss p rticles in he size range between 75 microns at the upper limit a 45 microns at the lower limit. The fluidized bed technique lead to a coating thickness which is uniform to !10%. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jul 27, 1962
Accession Number
AD0284989

Entities

People

  • Stanley Rodney

Tags

DTIC Thesaurus Topics

  • Beds (Process Engineering)
  • Embedding
  • High Temperature
  • Materials
  • Resistance
  • Thickness

Readers

  • Materials Science and Engineering.
  • Materials Science.
  • Snow Cover Descriptors for Reptiles and Their Illustrations.