TUNGSTEN TO GRAPHITE BONDING
Abstract
Tungsten to graphite carbide based bonds were evaluated as to tensile strength vs. temperature and thermal shock resistance. Tensile strengths varied from 530 psi at room temperature to 193 psi at 4000 F. No thermal shock failures were observed under the test conditions, 3500 F in ten seconds to a maximum temperature of 4425 F, followed by cooling to below red heat in 15 sec. The bonding procedure used for the data evaluation specimens had to be modified when the process was applied to the bonding of cylindrical tungsten inserts to segmented graphite backup structures. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 30, 1962
- Accession Number
- AD0285214
Entities
People
- J. Ralph Armstrong
- Roger A. Long