SEMICONDUCTOR RESISTIVE ELEMENT

Abstract

Work emphasized vapor deposition of polycrystalline elements. Methods of making ohmic contact, resistance adjustment, and packaging were considered. Overload tests of encapsulated devices gave indication of a high degree of stability on operating load life at rated power. Resist-ANCE-TEMPERATURE MEASUREMENTS WERE MADE. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 30, 1962
Accession Number
AD0287511

Entities

People

  • Olin B. Cecil
  • Raymond D. Puckett
  • Rodger B. Herrington

Organizations

  • Texas Instruments

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Compound Semiconductors
  • Electronics
  • Measurement
  • Metal-Semiconductor Junctions
  • Overload
  • Packaging
  • Polycrystals
  • Resistance
  • Semiconductors
  • Solid State Electronics
  • Vapor Deposition

Readers

  • Electronics Engineering
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems