ELECTRONIC PACKAGED SUBASSEMBLIES USING MECHANICAL METHODS FOR ELECTRICAL INTERCONNECTIONS BY THE USE OF THE STEWART-WARNER ELECTRONICS MECHANICAL ASSEMBLY TECHNIQUE

Abstract

A method of assembly of electronic components into subassemblies without the use of molecular bonds is reported. The system is based on the premise that initial pressure will compress all contacts beyond the elastic limit, the retaining pressure will be sufficient to take up some elasticity at all contacts for the range of operating and service conditions, and that the available retaining medium elongation will be larger than that of all contact combinations in order to compensate for all variations such as material flow, temperature, curing, aging or setting. (Author)

Document Details

Document Type
Technical Report
Publication Date
May 17, 1962
Accession Number
AD0287745

Tags

DTIC Thesaurus Topics

  • Assembly
  • Elastic Properties
  • Electronic Components
  • Electronic Equipment
  • Electronics
  • Elongation
  • Fabrication
  • Materials

Readers

  • Mechanical Engineering/Mechanics of Materials.
  • Software Engineering
  • Surface Coatings Technology.

Technology Areas

  • Microelectronics