ULTRA HIGH TEMPERATURE DIELECTRIC EMBEDDING MATERIALS

Abstract

A devitrifiable glass was developed which is completely compatible as a coating for the OX1A potting compound. Quasi-components (disc ) coated by using the fluidized bed process were evaluated for water absorption and high temperature electrical properties. A prototype resistor was developed which remained functional after exposure to temperatures slightly in excess of 600 C. (Author)

Document Details

Document Type
Technical Report
Publication Date
Oct 27, 1962
Accession Number
AD0291814

Entities

People

  • S. Rodney

Tags

DTIC Thesaurus Topics

  • Absorption
  • Beds (Process Engineering)
  • Electrical Impedance
  • Electrical Properties
  • Electricity
  • Embedding
  • Fluidized Bed Processes
  • High Temperature
  • Materials
  • Prototypes
  • Resistors

Fields of Study

  • Materials science

Readers

  • Agricultural Chemistry/Soil Science
  • Nanofabrication and Microfabrication.
  • Software Engineering