PRODUCTION ENGINEERING MEASURE RELIABILITY THRU PROCESS IMPROVEMENT

Abstract

Effort is presented on the Production engineering measure to increase transistor reliability. Process improvements within the major tasks of material evaluation, diffusion and photoresist, contact metallizing, lead attachment, and encapsulation were accomplished. Emphasis was placed on the method of contact metallizing and lead attachment. Sample quantities of devices utilizing an evaporated aluminum layer for base and emitter contacts were placed on life test. Equipment was received to begin aluminum wire bonding. Feasibility tests to determine stress levels of the step-stress aging were started. Reliability evaluation of production devices continued to further substantiate the failure rate basis from which the effects of the process improvement tasks will be measured. (Author)

Document Details

Document Type
Technical Report
Publication Date
Sep 30, 1962
Accession Number
AD0294110

Entities

People

  • F. Chien
  • S.h. Barnes

Tags

DTIC Thesaurus Topics

  • Aluminum
  • Attachment
  • Electronic Equipment
  • Encapsulation
  • Engineering
  • Life Tests
  • Metallizing
  • Production
  • Production Engineering
  • Reliability
  • Test And Evaluation

Fields of Study

  • Engineering

Readers

  • Software Engineering
  • Thin Film Deposition Science.