CASTABLE EXPLOSIVE COMPOSITIONS BASED ON DINITROPROPYLACRYLATE AND HMX

Abstract

The castable explosive, HMX/dinitropropylacrylate, was improved by formulation modifications to obtain higher energy, better physical properties and stability, and greater efficiency in preparation. Use of volatile liquids in mixing operations, special casting techniques, and selection of optimum HMX particle size blends resulted in solids loadings of 87 percent and higher with corresponding detonation velocities exceeding 8600 meters per second. Optimization of monomer inhibitor concentration made it possible to eliminate pre-processing DNPA purification, yet at the same time obtain adequate storage stability. Use of a new curative, cobalt acetyl acetonate, greatly facilitated curing by reducing time and temperature and eliminating the necessity for oxygen exclusion. Resulting castings were harder, more uniform, and more stable, with 150 C VTS values as low as 2.4 cc/g/48 hours. Two new copolymers of DNPA were prepared and evaluated as energetic binders, one with difluoraminopropylacrylate, the other with dodecafluoroheptylacrylate. Detonation velocities, as predicted by computation, were comparable to those for DNPA homopolymer at equivalent HMX loadings.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1967
Accession Number
AD0385014

Entities

People

  • Barbara A. Stott

Organizations

  • Naval Air Weapons Station China Lake

Tags

Communities of Interest

  • Counter IED
  • Engineered Resilient Systems
  • Ground and Sea Platforms
  • Weapons Technologies

DTIC Thesaurus Topics

  • Additives (Chemicals)
  • Dermatologic Agents
  • Energetic Materials
  • Ethers
  • Explosives
  • Heat Energy
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Testing
  • Measurement
  • Particle Size
  • Physical Properties
  • Plastic Bonded Explosives
  • Plastic Explosives
  • Test And Evaluation
  • Thermal Stability

Readers

  • Analytical Chemistry
  • Polymer Science and Engineering.
  • Rocket Propulsion.

Technology Areas

  • Microelectronics