PROCEEDINGS MICRO-MODULE INDUSTRY CONFERENCE, A SERIES OF PAPERS PRESENTED AT THE FIRST MICRO MODULE INDUSTRY CONFERENCE, PHILADELPHIA, PENNSYLVANIA, SEPTEMBER 12-13, 1962
Abstract
Contents: Mechanizembly system for micromodules Module assembly methods and requirements Incoming inspection Test jigs and fixtures Handling of microelement components Some problems associated with meeting the current 'land and lead' specifications and their solutions Land and notch metallizing on multilayer micro module capacitors Materials, metallization, tinning and handling Thermal conditioning of ceramic materials Glass-bonded mica as substrate material Calculations predicting physical and electrical characteristics of molybdenum films on micro element wafers Metallizing wafers Mounting components on wafers Plans for using micromodules in Army equipment Status and plans for specification, qualification approval and standardization A review of the micromodule program
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1962
- Accession Number
- AD0402716