SEMICONDUCTOR RELIABILITY
Abstract
Efforts were made to determine quality assurance requirements for specific semiconductor devices, and to determine confidence limits for the shape parameter beta of the Weilbull distribution. Reliability and life test data were obtained from manufacturers of semiconductor devices and equip ment and from field use. This data is analyzed and integrated to provide: (a) information on failure rates from life tests and field opera tion, (b) application data based on the varia bility of important electrical characteristics under life test conditions, and (c) information on decreasing failure ates and on responses of different junction types to application of various stresses.
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 30, 1963
- Accession Number
- AD0403120
Entities
People
- George J. Blakemore
Organizations
- ARINC