DESIGN AND EVALUATION OF THERMOELECTRIC THERMAL BARRIER FOR MICRO-MODULES
Abstract
Use of a specific Peltier temperature control device, called a 'thermoelectric thermal barrier,' to protect heat-sensitive electronic circuit elements from closely associated heat-producing elements in a microelectronic assembly is discussed. Test results on a simulated binary divider micro-module indicate the feasibility of the thermoelectric thermal barrier approach. Experimental results with a simulated micro module operating at temperatures between 25 C and 95 C indicate that it is possible under certain circumstances to protect a heat-sensitive element from a heat-generating element within the same micro-module by means of a small, low current Peltier device built directly into the micro module between these element.
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 01, 1962
- Accession Number
- AD0404893
Entities
People
- Herbert C. Frankel
- Robert D. Fitzgerald
Organizations
- United States Army Communications-Electronics Command