THERMOELECTRIC JUNCTIONING PROJECT

Abstract

The effort expended in the second quarter was mainly concerned with evaluation of solder alloys and their characteristics. The best solder series discovered during this period was a combination of bismuth, tin and antimony. Workable solders of this series were developed with melting points ranging from 400 to 273 F. Because surface cleanliness and preparation technique are extremely important in producing a superior solder joint, studies involving surface examination through electron microscopy were initiated to determine the surface contaminants. The sensitivity of the joint resistance scanner was improved by one order of magnitude to accurately determine resistance to 1 x 10 to the -7th power ohms.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Oct 31, 1962
Accession Number
AD0405620

Entities

People

  • R. G. Sickert

Organizations

  • Whirlpool Corporation

Tags

Communities of Interest

  • Ground and Sea Platforms

DTIC Thesaurus Topics

  • Alloys
  • Aluminum Oxides
  • Antimony
  • Contracts
  • Diffraction
  • Electron Diffraction
  • Electron Microscopy
  • Electrons
  • Elements
  • Environmental Pollutants
  • High Temperature
  • Joints
  • Materials
  • Melting
  • Melting Point
  • Oxides
  • Test And Evaluation

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Software Engineering
  • Surface Engineering/Surface Coating Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems