PEST REACTIONS IN INTERMETALLIC COMPOUNDS. 1. GRAIN BOUNDARY HARDENING IN NiGa.

Abstract

The phenomenon of grain boundary hardening has been explored for the CsCl structure intermetallic compound NiGa. NiGa has a homogeneity range of a few percent and it was possible to examine the effect of stoichiometry upon the grain boundary hardening due to preferential oxygen diffusion down grain boundaries. While some grain hardening was noticeable just below 50% Ga, the effect was much less pronounced than at 52% Ga. It was possible to estimate both bulk diffusion and grain boundary diffusion rates for oxygen. The results suggest that hardening is due to lattice distortions which arise from the formation of a Ga-O complex.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1963
Accession Number
AD0405821

Entities

People

  • A. U. Seybolt
  • J. H. Westbrook

Organizations

  • General Electric

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Alloys
  • Chemical Reactions
  • Chemistry
  • Crystal Structure
  • Crystals
  • Energy
  • Free Energy
  • Grain Boundaries
  • Hardening
  • Hardness
  • Heat Energy
  • Heat Treatment
  • Intermetallic Compounds
  • Materials
  • Measurement
  • Solid Solutions
  • Thermodynamics

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Powder metallurgy of Titanium alloys.