PRODUCTION ENGINEERING MEASURES TO INCREASE TRANSISTOR RELIABILITY

Abstract

The major area of engineering activity was on the following process steps: (1) epitaxial germanium control; (2) surface preparation for growth; (3) cleaning techniques to obtain optimum surface conditions; (4) welding techniques for encapsulation; (5) evaporation control; (6) mesa and dice cutting; (7) piece part incoming inspection; (8) photo masking; (9) lead attachment; and (10) contact materials.

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Document Details

Document Type
Technical Report
Publication Date
Jan 31, 1963
Accession Number
AD0407416

Entities

Organizations

  • Texas Instruments

Tags

DTIC Thesaurus Topics

  • Coatings
  • Contracts
  • Encapsulation
  • Engineering
  • Evaporation
  • Fabrication
  • Failure Analysis
  • Failure Mode And Effect Analysis
  • Germanium
  • Life Tests
  • Materials
  • Measurement
  • Production Engineering
  • Reliability
  • Reliability Engineering
  • Surface Properties
  • Test And Evaluation

Fields of Study

  • Materials science

Readers

  • Software Engineering
  • Thin Film Deposition Science.