SOLDERABILITY OF PRINTED CIRCUITS.

Abstract

The objective of this project is to develop test methods for the solderability testing of printed circuit boards to be used in dip and flow solder operations and to compile sufficient test data to enable the test method to be used under a variety of conditions. The redesign of the solderability test fixture and the development of a standard test pattern are discussed. Also covered are test results from natural and arti ficial aging of boards. A test technique has been developed in detail for dip solderability testing. (Author)

Document Details

Document Type
Technical Report
Publication Date
Mar 31, 1963
Accession Number
AD0407606

Entities

People

  • Joel Fabish

Organizations

  • General Electric

Tags

DTIC Thesaurus Topics

  • Circuit Boards
  • Circuits
  • Electronic Equipment
  • Printed Circuit Boards
  • Printed Circuits
  • Standards
  • Test Fixtures
  • Test Methods

Fields of Study

  • Engineering

Readers

  • Aerospace Test and Evaluation
  • Battery Technology and Engineering
  • Integrated Circuit Design and Technology.