BULK RELIABILITY EFFECTS IN SEMICONDUCTOR DEVICES. CURRENT CROWDING IN TRANSISTORS

Abstract

The problem of current crowding in transistors is reviewed and its relationship to transistor per formance described. A method is described where by a quantitative value can be assigned as a measure of the extent of crowding that occurs. The possible implications of current crowding in the operational reliability are described. An empirical figure of merit is developed relating the crowding factor to the physical parameters of the semiconductor device. Recommendations in device design are made which should improve the current handling capability of transistors.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1963
Accession Number
AD0408131

Entities

People

  • Bernard Reich
  • Edward B. Hakim

Organizations

  • United States Army Communications-Electronics Command

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Air Force Facilities
  • Bipolar Junction Transistors
  • Current Density
  • Electronic Components
  • Electronics
  • Electronics Laboratories
  • Figure Of Merit
  • Measurement
  • Military Research
  • New Jersey
  • Reliability
  • Semiconductor Devices
  • Semiconductors
  • Thermal Resistance
  • Transistors
  • United States

Readers

  • Semiconductor Device Technology
  • Systems Analysis and Design

Technology Areas

  • Microelectronics