Compatible Techniques for Integrated Circuitry

Abstract

Contents: Introduction; Thin Film Technology; Deposition of Glass Films; Tantalum Oxide Capacitors; Low Temperature Deposition of Tin; Packaging Research; Interconnections; Thin Film Fabrication; Design of Integrated Radio Frequency Amplifiers; Methods of Isolation of Active Elements in Integrated Circuits; Integrated Devices for Hybrid Circuits; Capacitors, Diodes, Transistors, Amplifiers; Digital System Design; Commutator Subsystems; Programmer and Reed-Muller Encoder; Binary to Binary Encoder; Programmer; Binary to Binary Decoder; Reference Switch, Multiplexer Switch, Comparator Amplifiers; System Design Adapted to Current Mode Logic; UHF Transreceiver Design and Fabrication; The Nature of the Hybrid Integrated Circuits; Summary of Pertinent Data on 120 Mc UHF Transreceiver Models.

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Document Details

Document Type
Technical Report
Publication Date
Aug 31, 1962
Accession Number
AD0409537

Entities

Organizations

  • Motorola Mobility

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Capacitance
  • Circuit Testers
  • Current Amplifiers
  • Dielectric Films
  • Epitaxial Growth
  • Fabrication
  • Field Effect Transistors
  • Logic Gates
  • Materials
  • Oscillators
  • Oxide Films
  • Oxides
  • Radio Frequency
  • Radio Frequency Amplifiers
  • Semiconductors
  • Voltage Amplifiers

Fields of Study

  • Engineering

Readers

  • Computer Programming and Software Development.
  • Integrated Circuit Design and Technology.
  • Thin Film Deposition Science.