The Processes and Development of Techniques of Miniaturized Gold Plated Through Holes in Printed Circuits

Abstract

This report describes the techniques developed and the procedures used successfully copper, nickel and gold plating small (0.040, 0.031, 0.020 and 0.016 in.) diameter plated through holes utilized as interface (side-to side) connections in double sided printed circuit boards.

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1963
Accession Number
AD0409676

Entities

People

  • Bernard Stepanski
  • Robert P. Hogan

Organizations

  • Frankford Arsenal

Tags

Communities of Interest

  • Weapons Technologies

DTIC Thesaurus Topics

  • Air Force
  • Chlorides
  • Circuit Boards
  • Circuits
  • Diameters
  • Electronics
  • Fabrication
  • Hydrochloric Acid
  • Materials
  • Metals
  • Munitions
  • Ordnance Laboratories
  • Printed Circuit Boards
  • Printed Circuits
  • Semiconductor Devices
  • Semiconductors
  • United States

Fields of Study

  • Chemistry

Readers

  • Integrated Circuit Design and Technology.
  • Microwave Engineering.
  • Surface Engineering/Surface Coating Technology.