CONFORMAL COATINGS FOR PRINTED CIRCUIT ASSEMBLIES.
Abstract
Phase A: Evaluate commercially available con formal coating materials used as protective coatings on printed circuit boards in order to obtain data for the preparation of a three services coordinated military specification which will provide sufficient physical, mechanical and electrical properties to assure satisfactory performance of printed circuit assemblies over long storage periods and under high humidity conditions. Phase B: Removal of the coating from the board. Phase C: Evaluate allowable minimum spacings between conductors on uncoated and coated boards as described in paragraphs 5.1.5 of MIL-STD-275A. Phase D: Effects of coatings on copper, gold and solder-plated con ductors with respect to their effect on ''Q'' factor and capacity at 1,50 and 100 mc using various spacings and configuration (consideration should be given to the spacings shown in paragraph 5.1.5 of MIL-STD-275). Specimens shall consist of single and double sided 1/16'' copper clad glass epoxy laminates and uncoated controls. Phase E: The information resulting from Phases A, B, C and D shall be used as a basis for redesign of the following AN/VRC-12 printed wiring boards to accept a conformal coating with minimum changes in physical and electrical char acteristics of the boards. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 30, 1963
- Accession Number
- AD0410381
Entities
People
- Anthony J. Beccasio
Organizations
- Motorola Mobility