PRINTED CIRCUIT CONNECTORS FOR MICROASSEMBLIES

Abstract

During this period, design effort was concentrated on a total of 11 contact approaches to mate with 0.016 to 0.020 in. dia microassembly pins. The contact designs were studied analytically and hand-made contacts of the most promising designs were fabricated and tested with regard to their retention characteristics. Six of the eleven contact designs were selected for further analysis. Analytical analyses of three connector design approaches for the 36 and 80 conductor encapsulated microassemblies were made.

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Document Details

Document Type
Technical Report
Publication Date
Mar 31, 1963
Accession Number
AD0410398

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  • Howard E. Dwan

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  • Advanced Electronics
  • C4I
  • Engineered Resilient Systems

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  • Chemical Engineering
  • Chemistry
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  • Dielectrics
  • Electronics
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  • Fabrication
  • Fasteners
  • Feasibility Studies
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  • New Jersey
  • Physical Properties
  • Printed Circuits
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  • United States

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