PRODUCTION ENGINEERING MEASURE, 2N914 AND 2N995.

Abstract

Contents: Lead Attach Improvement: change in metal system, small ball bonding, wire study, ultrasonic bonding, and dynamic and step stress testing; Preparation of substrate for epitaxial growth; Improve header plating; Eliminate gross particles; and Improve die attach.

Document Details

Document Type
Technical Report
Publication Date
Apr 30, 1963
Accession Number
AD0411130

Entities

People

  • P. M. Weiler

Tags

DTIC Thesaurus Topics

  • Engineering
  • Epitaxial Growth
  • Manufacturing Engineering
  • Particles
  • Production
  • Production Engineering
  • Production Management Methods
  • Productivity
  • Substrates

Readers

  • Combustion and Flow Dynamics.
  • Semiconductor Device Technology
  • Surface Engineering/Surface Coating Technology.