PRODUCTION ENGINEERING MEASURES TO INCREASE TRANSISTOR RELIABILITY.
Abstract
Work continued on the process items and progress was made in the following areas: (1) Continued improvement was made in material preparation area, particularly in the area of slice cleaning; (2) The new package was tooled and modified slightly. A machine for accurately assembling the slug and header was built and evaluated satisfactorily; (3) Work continued on improved contacts. A gold alloy collector braze and a cold-bonded aluminum emitter and base contact was adopted for the planar device; (4) Several pieces of equipment were built to facilitate process control; and (5) Planar diffusion processes were optomized in production facilities. The Dry Box Line for assembling the planar device was made operational. The areas of engineering activity were as follows: (1) Material preparation, (2) Cleaning techniques and problems, (3) Assembly prior to encapsulation, (4) Package improvement, (5) Quality assurance, and (6) Value achievement. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 31, 1962
- Accession Number
- AD0411267
Entities
Organizations
- Texas Instruments