TRACE IMPURITY EFFECTS ON GROWTH HILLOCKS DURING EPITAXIAL ELECTRODEPOSITION FROM COPPER PERCHLORATE SOLUTIONS.

Abstract

Growth hillocks ordinarily cover the surface of copper electrodeposits from reagent grade solutions. A 75% decrease in the number of hil locks was observed when the plating baths were purified by pre-electrolysis and oxidation. When gelatin or Pb were added in ppm or ppb concentration to the purified solutions, the surfaces of new electrodeposits were then completely covered with growth hillocks. It is concluded that the formation of surface features during electrodeposition from reagent grade solutions is affected/3 the presence of trace impurities. (Author)

Document Details

Document Type
Technical Report
Publication Date
May 01, 1963
Accession Number
AD0411873

Entities

People

  • D. Shanefield
  • P.e. Lighty

Organizations

  • ITT Corporation

Tags

DTIC Thesaurus Topics

  • Chemical Reactions
  • Coatings
  • Deposition (Materials Processing)
  • Electrodeposition
  • Electrolysis
  • Electrolytic Processes
  • Electroplating
  • Impurities
  • Material Coating Processes
  • Materials Processing
  • Oxidation
  • Perchlorates
  • Plating

Readers

  • Analytical Chemistry
  • Thin Film Deposition Science.