INTERCONNECTION OF FUNCTIONAL ELECTRONIC BLOCKS.
Abstract
The objectives of this program are: (1) develop ment of a reliable and high yield interconnection process; (2) automation of the process; and (3) development of an interconnection matrix - pack aging system for the interconnection of integral devices. Electron beam techniques are in the process of being developed into an automated joining process. The basic unit of the inter connection system is a ceramic multilayer struc ture with an extremely high-horizontal and verti cal interconnection-capability. The top wafer of the structure is equipped with grooves within which FEB's packaged in flat form containers may be attached. Both alumina and beryllia are being used as the substrate materials. Vacuum deposi tion, electron beam scribing or etching, elec troplating and brazing comprise the processes used to fabricate the multilayer structure. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 30, 1963
- Accession Number
- AD0413114
Entities
People
- D.j. Garibotti
- K.o. Olson