BONDING AGENTS AND THE TECHNOLOGY OF ADHESIVE BONDING (Klei i Tekhnologiya Skleivaniya),

Abstract

This volume contains basic information on bonding agents based on phenol-formaldehyde, epoxy, polyurethane and polyamide resins, silicon organic compounds and their combinations with other polymers. The basic properties of the adhesives are described, and certain problems of adhesive-bonding theory, as well as testing and quality-control methods for adhesive com pounds, are examined. Problems of the technique of applying adhesive compounds are considered in detail. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 06, 1963
Accession Number
AD0413167

Entities

People

  • D.a. Kardashow

Organizations

  • National Air and Space Intelligence Center

Tags

DTIC Thesaurus Topics

  • Adhesive Bonding
  • Adhesives
  • Bonding
  • Formaldehyde
  • Materials
  • Organic Compounds
  • Polymers
  • Polyurethanes
  • Quality Control
  • Resins
  • Specialty Uses Of Chemicals

Fields of Study

  • Materials science

Readers

  • Polymer Science and Engineering.
  • Theoretical Analysis.