A GENERAL PURPOSE LOW-SPEED DIAMOND SAW FOR ACCURATELY CUTTING SEMICONDUCTOR INFRA-RED AND LASER MATERIALS

Abstract

An experimental diamond saw is described which revolves at low speed. The methods used to true the blade are given. A simple micrometer-feed and damping arrangement to provide chip-free cutting of thin semiconductor blanks is an essential feature of this device. In addition to its more delicate performance, the saw is used to shape various laser-rod materials.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1963
Accession Number
AD0413896

Entities

People

  • G. W. Fynn
  • W. J. Powell

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Alkanes
  • Blades
  • Detectors
  • Diameters
  • Diamond Wheels
  • Government (Foreign)
  • Heavy Duty
  • Indium Antimonides
  • Laser Materials
  • Lubricants
  • Materials
  • Micrometers
  • Right Angles
  • Saws
  • Semiconductor Devices
  • Semiconductors
  • Technical Information Centers

Readers

  • Aerodynamics.
  • Manufacturing Engineering.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Directed Energy
  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems