COMPATIBLE TECHNIQUES FOR INTEHRATED CIRCUITRY
Abstract
The design and manufacturing flexibility to be attained through the combination of semiconductor and thin film technologies is presented. The utilization of a wide variety of materials to construct circuit elements provides wider range of component values to closer tolerances than can be achieved if only one technology and material is used. Furthermore, the component parasitic parameters such as temperature coefficients, voltage sensitivity and loss factors can be better controlled if more than one material is available to construct components. Of great importance is the electrical isolation of critical circuit elements which is achievable when thin film elements are combined with silicon elements. In summary, the principle advantages of a compatible thin film - single block silicon technology are listed.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 31, 1963
- Accession Number
- AD0414104
Entities
Organizations
- Motorola Mobility