A POROUS SUBSTRATE RESISTOR AIMED AT MINIATURIZA TION OF METAL-FILM RESISTORS.

Abstract

Several parameters necessary for the successful manufacture of porous substrate resistors were established. Specifically, quartz was decided upon as the material of construction and the pore size was determined on the basis of avail ability and suitability to wattage requirements and resistor dimensions. The optimum temperature of heat treatment was established as 400 F and a method of termination utilizing silver braz ing was found to be quite successful. Heat dis sipation was related to resistor dimensions and shown to have no correspondence with pore size and/or film thickness. Impregnation as a means of enhancing heat dissipation was investigated with negative results. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jun 30, 1963
Accession Number
AD0417222

Entities

People

  • Theodore Matley

Tags

DTIC Thesaurus Topics

  • Construction
  • Dissipation
  • Film Resistors
  • Films
  • Heat Treatment
  • Impregnation
  • Materials
  • Metal Films
  • Resistors
  • Substrates
  • Textiles
  • Thickness

Readers

  • Reinforced Composite Materials
  • Systems Analysis and Design
  • Thin Film Deposition Science.