A HEAT FLOW PROBLEM IN ELECTRON BEAM ETCHING OF THIN FILMS,
Abstract
As the problems of modern science and technology become more complex, the need arises for digital computers of greatly increased speed and storage capacity. Previous work indicated that computer components may be made from thin metallic films, and that the possible switching times of such components may be such that the overall speed of the computer will be limited by the transit time of a signal from one part of the computer to an other, rather than by the speed of the components themselves. One approach to miniaturization is to etch components and circuits in a thin film by heating microscopic regions of the film to evaporation temperatures with an electron beam. A study is presented of the heat flow problem, which is simplified to the problem of finding the temperature rise on a thin plate, with a uniform circular source of heat in uniform rectilinear motion on the plate. The temperature was found as a function of position and velocity in terms of a double integral. An IBM 704 com puter program was written to perform the numer ical evaluation of the integral. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 01, 1959
- Accession Number
- AD0418574
Entities
People
- Francis Keith Reed
Organizations
- Massachusetts Institute of Technology