MOLECULAR STRUCTURE AND PHYSICAL BEHAVIOR OF POLYMERS.

Abstract

Eight model copolymers were prepared by standard ester interchange techniques. They are poly (cis-trans 1,4-cyclohexylene dimethylene sebac ates) in which the percentage of the (trans 1,4 cyclohexylene dimethylene) groups ranges from 0 to 100%. The molecular weights were estimated from intrinsic viscosity determinations and by end group analysis. They appear to lie in the range 5,000 to 8,000. The melting temperatures were measured after crystallization at various tem peratures. By an extrapolation procedure the equilibrium melting temperatures were deduced. They showed a characteristic eutectic effect, the 30% trans copolymer having the lowest melting point. The rates of crystallization varied sharp ly with the crystallization temperature. The re lations for the different polymers were displaced along the temperature axis roughly in accord with their equilibrium melting temperatures. A signif ficant molecular weight effect was observed, the lower molecular weight polymers crystallizing more slowly at a given temperature. The amount of crystallization attained was found to vary with temperature in a complex manner. Several of the copolymers showed two maxima, whereas the homo polymers apparently gave a single sharp maximum at a temperature about 20 C below the equilibrium melting temperature. (Author)

Document Details

Document Type
Technical Report
Publication Date
Apr 30, 1963
Accession Number
AD0418648

Entities

People

  • Alan Neville Gent
  • M. Morton

Organizations

  • University of Akron

Tags

DTIC Thesaurus Topics

  • Copolymers
  • Crystallization
  • Extrapolation
  • Isothermal Processes
  • Melting
  • Melting Point
  • Molecular Structure
  • Molecular Weight
  • Phase Transformations
  • Polymers
  • Standards
  • Thermodynamic Processes
  • Transition Temperature
  • Viscosity

Fields of Study

  • Chemistry

Readers

  • Materials Science and Engineering.
  • Polymer Science and Technology
  • Snow Cover Descriptors for Reptiles and Their Illustrations.

Technology Areas

  • Microelectronics