MICROELECTRONIC CIRCUITRY IN MICRO-MODULES.

Abstract

This report describes the steps undertaken in the microminiaturization of Signal Corps modules used in a subassembly previously manufactured from standard components. This subassembly is a shift register consisting of 28 flip-flops, one 4-gate networks, and three driver circuits. For each type of circuit, a typical layout every film is shown at 10X scale. For the first con ductor film on the flip-flop circuits, the com plete 16 position mask is shown in full scale. A description of the material used, the thick ness, and the functions of each film is given, together with the method of monitoring during deposition. (Author)

Document Details

Document Type
Technical Report
Publication Date
Oct 08, 1962
Accession Number
AD0418715

Entities

People

  • And R. Putz
  • Hannsjörg A. Weber
  • S. Petertyl
  • S. Weld

Tags

DTIC Thesaurus Topics

  • Circuits
  • Electrical Circuits
  • Electrical Equipment
  • Electronic Circuits
  • Electronic Equipment
  • Flip Flop Circuits
  • Logic Devices
  • Logic Gates
  • Materials
  • Microminiaturization
  • Monitoring
  • Networks
  • Shift Registers
  • Standards

Fields of Study

  • Physics

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene