THE EFFECTS OF DIP SOLDERING UPON VARIOUS BOARD MATERIALS AND SOLDER RESIST USED IN PRINTED CIRCUITS

Abstract

This report describes the procedures in conducting eleven dip soldering tests to determine the effects that dip soldering at various temperatures and times has upon various printed circuit board materials, and solder resist materials. It discusses the results and conclusions of these soldering tests.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1963
Accession Number
AD0419035

Entities

People

  • Bernard Stepanski
  • Robert P. Hogan

Organizations

  • Frankford Arsenal

Tags

Communities of Interest

  • Weapons Technologies

DTIC Thesaurus Topics

  • Air Force
  • Air Force Facilities
  • Circuit Boards
  • Circuits
  • Electronic Circuits
  • Electronics
  • Government Procurement
  • Materials
  • Mechanical Properties
  • Munitions
  • Ordnance Laboratories
  • Preservatives
  • Printed Circuit Boards
  • Printed Circuits
  • Standards
  • Thermal Shock
  • United States

Fields of Study

  • Materials science

Readers

  • Software Engineering
  • Thermal Physics or Thermal Science.