Mechanization of Semiconductor Device Manufacturing 2N559 and 2N1094 Transistors
Abstract
Contents: Modification of transistor processing and production equipment, Wire bondng, Handling tray loading, Tinning transistor leads, Slice surface preparation, Stripe evaporation and alloying, Header thermal capability, Wire welding, Material handling, Pneumatic components, Diffusion, Silicon dioxide coating, Header internal lead trimming.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 30, 1963
- Accession Number
- AD0419209
Entities
People
- M. N. Reppert