A DUAL CELL PLATING APPARATUS FOR DEPOSITION OF MULTI-LAYER METAL SYSTEMS
Abstract
An experimental dual cell apparatus for the electrodeposition of alternating metal layers (binary systems) employing a rotating cathode is described. Microstructures of multi-layered systems of Ni-Cu and Ni-Fe are shown and some of their properties are discussed and evaluated. X-ray diffraction data on the behavior of the Ni Cu systems are given. Also shown is the multi-layered Ni-Cr microstructure.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 01, 1963
- Accession Number
- AD0419325
Entities
People
- V. P. Greco