PRODUCTION ENGINEERING MEASURE 2N914 AND 2N995.

Abstract

Contents: Lead Attach Improvement; a. Change in Metal System, b. Small Ball Bonding, c. Wire Study, d. Ultrasonic Bonding, e. Dynamic + Step Stress Testing; Preparation of Substrate for Epitaxial growth; Improve Header Plating; Eliminate Gross Particles.

Document Details

Document Type
Technical Report
Publication Date
Jul 31, 1963
Accession Number
AD0422641

Entities

People

  • P. M. Weiler

Tags

DTIC Thesaurus Topics

  • Engineering
  • Epitaxial Growth
  • Manufacturing Engineering
  • Particles
  • Production
  • Production Engineering
  • Production Management Methods
  • Productivity
  • Substrates

Readers

  • Semiconductor Device Technology
  • Surface Engineering/Surface Coating Technology.
  • Systems Analysis and Design