THERMOELECTRIC JUNCTIONING PROJECT.

Abstract

Work during the fifth quarterly period of this investigation included further analysis of solders to be used in high temperature applications (exceed 300 F) with better mechanical and electrical properties, the rate and effect of diffusion on thermoelectric materials with various alloys at different temperatures and extended times, and better metallographic techniques to analyze the results of various phenomenon observed during experimentation. (Author)

Document Details

Document Type
Technical Report
Publication Date
Jul 31, 1963
Accession Number
AD0422685

Entities

People

  • James E. Robinson

Organizations

  • Whirlpool Corporation

Tags

DTIC Thesaurus Topics

  • Diffusion
  • Electrical Properties
  • High Temperature

Fields of Study

  • Materials science

Readers

  • Library and Information Science
  • Solar Photovoltaics and Thermoelectric Devices.
  • Surface Engineering/Surface Coating Technology.