PRODUCTION ENGINEERING MEASURE ON SILICON ALLOY TRANSISTORS.

Abstract

Efforts continued on the improvement of production techniques to increase the reliability of silicon transistors. Further control of chip dimensions was achieved. The bulk material parameters of resitivity and dislocation density were studied. Metallographic analysis of alloying led to firing jig redesign. The effects of tin, dislocation density, and chip thickness on alloying were determined. An improved emitter whisker was introduced. High temperature solder was introduced with partial flux elimination. A new approach to more efficient etching was explored. Step-stress equipment is under construction. Formal failure mode analysis is initiated. Operation standards, drawings, and quality inspection procedures were issued and work on the inspection and quality control plan was initaiated. (Author)

Document Details

Document Type
Technical Report
Publication Date
Mar 31, 1963
Accession Number
AD0422940

Entities

People

  • R. W. Jones

Organizations

  • RTX

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Bulk Materials
  • Dislocations
  • Electronic Equipment
  • Engineering
  • Failure Mode And Effect Analysis
  • High Temperature
  • Inspection
  • Materials
  • Production
  • Production Engineering
  • Quality Control
  • Silicon
  • Silicon Alloys
  • Transistors

Fields of Study

  • Materials science

Readers

  • Integrated Circuit Design and Technology.
  • Powder metallurgy of Titanium alloys.
  • Software Engineering