A MECHANICAL POLISHING TECHNIQUE FOR SEMICONDUCTOR MATERIALS,
Abstract
A method for obtaining a very finely polished surface on semiconductor wafers has been devised. The mechanical arrangements include a polishing machine in which special care is used to continuously remove the abraded semiconductor particles from the polishing medium. The method uses only two major operations and yields a polished surface that is measurably smoother and flatter than the commercially polished specimens examined for comparison. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 30, 1963
- Accession Number
- AD0423555
Entities
People
- C. H. Klute
- R. B. Beams
Organizations
- Harry Diamond Laboratories