BONDING OF FOAM PLASTICS BY MEANS OF HIGH-FREQUENCY HEATING

Abstract

The possibility of connecting (bonding) foam plastics by means of internal heating in a high frequency field that speeds up the process and gives a firm connection was studied. Bonding is performed as follows. On the surface of one of the parts to be bonded, a thin layer of adhesive (or water) is spread; the parts are then compressed and placed in a high-frequency electrical field. The damp inner layer is quickly heated to 100 - 130 C, and the joined layers of foam plastic fuse and bond. During the experimental processes the characteristics of the behavior of materials during heating were studied, heating conditions and regimes were found, and dielectric properties of the foam plastic and the zones of bonded seams before and after bonding were measured.

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Document Details

Document Type
Technical Report
Publication Date
Oct 25, 1963
Accession Number
AD0423958

Entities

People

  • L. M. Koval'chuk
  • Tr. By Ingeborg V. Baker

Tags

Communities of Interest

  • Advanced Electronics
  • Weapons Technologies

DTIC Thesaurus Topics

  • Adhesives
  • Air Gaps
  • Biomedical And Dental Materials
  • Coaxial Cables
  • Corporations
  • Dielectric Properties
  • Electrodes
  • Formaldehyde
  • Frequency
  • Mass Production
  • Materials
  • Measurement
  • Plastics
  • Q Meters
  • Resins
  • Scientific Research
  • Tank Guns

Fields of Study

  • Materials science

Readers

  • Electrical Engineering
  • Fire Suppression Systems Design.
  • Surface Coatings Technology.