BEHAVIOR OF ORGANIC STRESS PREVENTING AGENTS IN NICKEL PLATING SOLUTIONS,
Abstract
Two organic stress relieving agents, naphthalene 1,3,6 trisulfonic acid and saccharin were tested at three concentrations each in a nickel sulfamate plating bath by using a radioactive tag to determine the amount of the agent deposited with the plate. Tests were conducted at temperatures of 90, 110 and 130 F and current densities of 20, 40, 60 and 80 amperes per sq ft. The amount deposited varied directly with concentration and indirectly with current density. It was also found that there was a relationship between the amount of the additive deposited and the compressive stress results taken from the literature. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 14, 1963
- Accession Number
- AD0424466
Entities
People
- Stanley L. Eisler